Thin PCB|HYG306F02018A
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Product Details
Layer : 2L
Base Material : PI 50um
Board Thickness : 0.12±0.03mm
Final Copper Thickness: Min 15um
Surface Finished: ENIG
Unit Size(mm) : 2.0*18.7
Panel Size(mm) : 35.0*58.0
Min Hole Copper Thickness : 12um
Min W/S(mil) : 3.94/3.94
Solder Mask Color : green
Coverlay: yellow
ISO Certification
UL Certification
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Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.